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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/19/2003
Application #:
10058557
Filing Dt:
01/28/2002
Publication #:
Pub Dt:
07/31/2003
Inventors:
Shiuh-Hui Steven Chen, Raymond Garza, Carl Ross, Stefan Turalski
Title:
SEMICONDUCTOR WAFER HAVING A THIN DIE AND TETHERS AND METHODS OF MAKING THE SAME
Assignment: 1
Reel/Frame:
012550/0770Recorded: 01/28/2002Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/25/2002
Exec Dt:
01/25/2002
Exec Dt:
01/25/2002
Exec Dt:
01/25/2002
Assignee:
1303 EAST ALGONQUIN ROAD
SCHAUMBURG, ILLINOIS 60196
Correspondent:
MOTOROLA, INC.
THOMAS V. MILLER
1303 E. ALGONQUIN ROAD
SCHAUMBURG, IL 60196
Assignment: 2
Reel/Frame:
018471/0170Recorded: 10/31/2006Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/16/2006
Assignee:
21440 WEST LAKE COOK ROAD, 7TH FLOOR
PATENTS & LICENSES
DEER PARK, ILLINOIS 60010
Correspondent:
CONTINANTAL AUTOMOTIVE SYSTEMS
TEMIC AUTOMOTIVE OF NORTH AMERICA, INC.
GARY J. CUNNINGHAM
21440 WEST LAKE COOK ROAD, 7TH FLOOR
DEER PARK, IL 60010

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