Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/30/2003
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Application #:
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09910633
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Filing Dt:
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07/20/2001
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Publication #:
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Pub Dt:
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01/23/2003
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Inventors:
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Ting-Chun Wang, Kei-Wei Chen, Shih-Tzung Chang, Ying-Lang Wang, Yu-Ku Lin
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Title:
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METHOD FOR IMPROVING THICKNESS UNIFORMITY ON A SEMICONDUCTOR WAFER DURING CHEMICAL MECHANICAL POLISHING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 121 PARK AVENUE 3 SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN R.O.C |
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TUNG & ASSOCIATES |
RANDY W. TUNG |
838 W. LONG LAKE ROAD |
SUITE 120 |
BLOOMFIELD HILLS, MI 48302 |
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