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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
6646343
Issue Dt:
11/11/2003
Application #:
10173210
Filing Dt:
06/14/2002
Inventors:
Nirmal Sharma, Jason Chen, song ge
Title:
MATCHED IMPEDANCE BONDING TECHNIQUE IN HIGH-SPEED INTEGRATED CIRCUITS
Assignment: 1
Reel/Frame:
015603/0886Recorded: 07/26/2004Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
BITBLITZ COMMUNICATIONS, INC.
Exec Dt:
05/21/2004
Assignee:
INTERSIL CORPORATION
675 TRADE ZONE BLVD.
MILPITAS, CALIFORNIA 95035
Correspondent:
O'MELVENY & MYERS LLP
SCOTT D. SANFORD
275 BATTERY STREET, 26TH FLOOR
SAN FRANCISCO, CA 94111-3305
Assignment: 2
Reel/Frame:
024390/0608Recorded: 05/05/2010Pages: 125
Conveyance:
SECURITY AGREEMENT
Assignors:
INTERSIL CORPORATION
Exec Dt:
04/27/2010
TECHWELL, INC.
Exec Dt:
04/27/2010
INTERSIL COMMUNICATIONS, INC.
Exec Dt:
04/27/2010
QUELLAN, INC.
Exec Dt:
04/27/2010
ZILKER LABS, INC.
Exec Dt:
04/27/2010
KENET, INC.
Exec Dt:
04/27/2010
INTERSIL AMERICAS INC.
Exec Dt:
04/27/2010
ELANTEC SEMICONDUCTOR, INC.
Exec Dt:
04/27/2010
D2AUDIO CORPORATION
Exec Dt:
04/27/2010
PLANET ATE, INC.
Exec Dt:
04/27/2010
Assignee:
MORGAN STANLEY & CO. INCORPORATED
ONE PIERREPONT PLAZA, 7TH FLOOR
300 CADMAN PLAZA WEST
BROOKLYN, NEW YORK 11201
Correspondent:
JOSHUA H. RAWSON
DECHERT LLP
1095 AVENUE OF THE AMERICAS
NEW YORK, NY 10036

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