Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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05/25/2004
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Application #:
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10202992
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Filing Dt:
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07/25/2002
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Publication #:
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Pub Dt:
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01/29/2004
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Inventor:
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Hua Ji
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Title:
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METHOD OF ETCHING A DIELECTRIC MATERIAL IN THE PRESENCE OF POLYSILICON
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SCIENCE-BASED INDUSTRIAL PARK |
NO. 19 LI HSIN ROAD |
HSIN CHU CITY, TAIWAN |
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MACPHERSON, KWOK, CHEN 7 HEID LLP |
ALAN H. MACPHERSON |
2402 MICHELSON DRIVE |
SUITE 210 |
IRVINE, CA 92612 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 19 LI HSIN ROAD |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN CHU CITY, TAIWAN |
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MACPHERSON, KWOCK CHEN ET AL. |
TOM CHEN |
2402 MICHELSON DR., STE. 210 |
IRVINE, CA 92612 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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393, RUE ST-JACQUES, SUITE 500 |
MONTREAL, QUEBEC H2Y 1N9 |
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CANTOR COLBURN LLP |
DANIEL F. DREXLER |
55 GRIFFIN ROAD SOUTH |
BLOOMFIELD, CT 06002 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3F, NO. 19, LI-HSIN ROAD |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU CITY, TAIWAN |
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MACPHERSON KWOK CHEN & HEID LLP |
MICHAEL SHENKER |
1762 TECHNOLOGY DRIVE |
STE. 226 |
SAN JOSE, CA 95110 |
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