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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
10/19/2004
Application #:
10359403
Filing Dt:
02/05/2003
Publication #:
Pub Dt:
07/31/2003
Inventors:
Serge Vanhaelemeersch, Herman Meynen, Philip D. Dembowski
Title:
INTEGRATED CIRCUIT HAVING SIC LAYER
Assignment: 1
Reel/Frame:
014921/0290Recorded: 07/30/2004Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/22/2001
Exec Dt:
11/20/2001
Exec Dt:
11/30/2001
Assignees:
KAPELDREEF 75
LEUVEN, NETHERLANDS 3001
2200 W. SALZBURG ROAD
MIDLAND, MICHIGAN 48686-0994
Correspondent:
PATRICIA ANN MERRILL
77 WEST WACKER
CHICAGO, IL 60622
Assignment: 2
Reel/Frame:
014725/0059Recorded: 06/11/2004Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/12/2004
Assignee:
KAPELDREEF 75
LEUVEN, BELGIUM 3001
Correspondent:
MICHELLE MCMULLEN, JONES DAY
2727 NORTH HARWOOD STREET
DALLAS, TX 75201-1515

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