Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/02/2004
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Application #:
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10033990
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Filing Dt:
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12/28/2001
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Publication #:
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Pub Dt:
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07/03/2003
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Inventors:
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Sharad M. Shah, David R. Bach, Angelo Villani, Nicholas Palmer
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Title:
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DUAL INTERPOSER PACKAGING FOR HIGH DENSITY INTERCONNECT
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 20555 SH 249 |
| HOUSTON, TEXAS 77070 |
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| HEWLETT-PACKARD COMPANY |
| VALERIE BAKES |
| P.O. BOX 272400, RECORDS MANAGER |
| INTELLECTUAL PROPERTY ADMINISTRATION |
| FORT COLLINS, CO 80527-2400 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 20555 SH 249 |
| HOUSTON, TEXAS 77070 |
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| RECORDS MANAGER |
| INTELLECTUAL PROPERTY ADMINISTRATION |
| HEWLETT-PACKARD COMPANY |
| P.O. BOX 272400 |
| FORT COLLINS, CO 80527-2400 |
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