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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/21/2004
Application #:
10065803
Filing Dt:
11/20/2002
Publication #:
Pub Dt:
05/20/2004
Inventors:
Chun-Jen Weng, Juan-Yi Chen, Hong-Tsz Pan, Cedric Lee, Der-Yuan Wu, Jackson Lin et al
Title:
GAP-FILLING PROCESS
Assignment: 1
Reel/Frame:
013257/0242Recorded: 11/20/2002Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/11/2002
Exec Dt:
11/11/2002
Exec Dt:
11/11/2002
Exec Dt:
11/11/2002
Exec Dt:
11/11/2002
Exec Dt:
11/11/2002
Exec Dt:
11/11/2002
Exec Dt:
11/11/2002
Exec Dt:
11/11/2002
Assignee:
HSINCHU, TAIWAN
Correspondent:
J C PATENTS, INC.
4 VENTURE, SUITE 250
IRVINE, CA 92618

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