Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/11/2005
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Application #:
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10036389
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Filing Dt:
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01/07/2002
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Publication #:
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Pub Dt:
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07/10/2003
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Inventors:
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Cheng-Yi Liu, Johanna Swan, Steven Towle
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Title:
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THINNED DIE INTEGRATED CIRCUIT PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 58119 |
| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95052 |
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| KENYON & KENYON |
| CLINT GERDINE, ESQ. |
| 1500 K STREET NW, SUITE 700 |
| WASHINGTON, DC 20005 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95052 |
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| SCHWEGMAN LUNDBERG WOESSNER, ET AL. |
| ANN M. MCCRACKIN |
| P.O. BOX 2938 |
| MINNEAPOLIS, MN 55402 |
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