Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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04/05/2005
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Application #:
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10618953
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Filing Dt:
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07/14/2003
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Publication #:
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Pub Dt:
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01/20/2005
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Inventors:
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Scott D. Brandenburg, David A. Laudick
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Title:
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WAFER APPLIED THERMALLY CONDUCTIVE INTERPOSER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LEGAL STAFF - MAIL CODE: 480-410-202 P.O. BOX 5052 |
| TROY, MICHIGAN |
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| STEFAN V. CHMIELEWSKI |
| DELPHI TECHNOLOGIES, INC. |
| LEGAL STAFF MC CT10C |
| P.O. BOX 9005 |
| KOKOMO, INDIANA 46904-9005 |
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Assignment:
2
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| P.O. BOX 2558 |
| HOUSTON, TEXAS 77252 |
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| MARK SOLOMON, ESQ. |
| SIMPSON THACHER & BARTLETT LLP |
| 425 LEXINGTON AVENUE |
| NEW YORK, NY 10017 |
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Assignment:
3
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RELEASE OF SECURITY AGREEMENT
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| 5725 DELPHI DRIVE |
| TROY, MICHIGAN 48098 |
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| MICHAEL D. SMITH |
| DELPHI CORPORATION |
| LEGAL STAFF - M/S 480-410-202 |
| 5725 DELPHI DRIVE |
| TROY, MI 48098 |
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