Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/21/2005
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Application #:
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10135559
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Filing Dt:
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04/29/2002
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Publication #:
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Pub Dt:
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11/13/2003
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Inventors:
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Thomas A. Kocian, Richard L. Knipe, Mark H. Strumpell
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Title:
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MEMS DEVICE WAFER-LEVEL PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MS 3999 |
| P.O. BOX 655474 |
| DALLAS, TEXAS 75265 |
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| BAKER & MCKENZIE |
| BRIAN M. MCCORMACK |
| 2001 ROSS AVENUE, SUITE 2300 |
| DALLAS, TX 75201 |
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