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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/02/2005
Application #:
09921612
Filing Dt:
08/03/2001
Publication #:
Pub Dt:
02/06/2003
Inventors:
Harjinder Dulai, Yen-Ming Chen, Colin Szeto, Edward J. Laurin, Steven D. Daniels et al
Title:
HIGH DENSITY INTERCONNECTION DEVICE
Assignment: 1
Reel/Frame:
012091/0204Recorded: 08/03/2001Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/20/2001
Exec Dt:
06/18/2001
Exec Dt:
06/19/2001
Exec Dt:
07/03/2001
Exec Dt:
07/23/2001
Exec Dt:
08/02/2001
Assignee:
33 COMMERCE VALLEY DRIVE EAST
THORNHILL, ONTARIO, CANADA L3T7N
Correspondent:
VEDDER, PRICE, KAUFMAN & KAMMHOLZ
MICHAEL J. TURGEON
222 NORTH LASALLE STREET
SUITE 2400
CHICAGO, IL 60601
Assignment: 2
Reel/Frame:
026270/0027Recorded: 05/12/2011Pages: 8
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/25/2006
Assignee:
1 COMMERCE VALLEY DRIVE EAST
MARKHAM, ONTARIO, CANADA L3T 7X6
Correspondent:
CHRISTOPHER J. RECKAMP
222 N. LASALLE STREET
VEDDER PRICE P.C.
CHICAGO, IL 60601

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