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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/28/2006
Application #:
10674370
Filing Dt:
09/30/2003
Publication #:
Pub Dt:
04/14/2005
Inventors:
Xiaowei Yao, Tam Nguyen, Marc Finot, Rickie C. Lake, Jeffrey A. Bennett, Robert Kohler
Title:
CIRCUIT PACKAGE AND METHOD OF PLATING THE SAME
Assignment: 1
Reel/Frame:
014848/0410Recorded: 01/05/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/29/2003
Assignee:
2200 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95052
Correspondent:
MARSHALL GERSTEIN & BORUN LLP
AARON M. PETERS
233 S. WACKER DRIVE, SUITE 6300
SEARS TOWER
CHICAGO, IL 60606-6357
Assignment: 2
Reel/Frame:
014848/0416Recorded: 01/05/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/29/2003
Exec Dt:
10/29/2003
Exec Dt:
10/27/2003
Exec Dt:
11/01/2003
Exec Dt:
10/28/2003
Assignee:
2200 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95052
Correspondent:
MARSHALL, GERSTEIN & BORUN LLP
AARON M. PETERS
233 S. WACKER DRIVE
SUITE 6300, SEARS TOWER
CHICAGO, IL 60606-6357

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