Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/04/2006
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Application #:
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10967910
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Filing Dt:
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10/18/2004
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Publication #:
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Pub Dt:
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05/12/2005
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Inventors:
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Hsueh-Te Wang, Meng-Jen Wang, Chien Liu, Chi-Hao Chiu
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Title:
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QUAD FLAT FLIP CHIP PACKAGING PROCESS AND LEADFRAME THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26, CHIN R4D. RD, 811 NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN R.O.C. |
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| J.C. PATENTS |
| 4 VENTURE |
| SUITE 250 |
| IRVINE, CA 92618 |
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