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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/16/2006
Application #:
11108603
Filing Dt:
04/18/2005
Publication #:
Pub Dt:
10/13/2005
Inventor:
Yungjun Jeff Hu
Title:
CONDUCTIVE MATERIAL FOR INTEGRATED CIRCUIT FABRICATION
Assignment: 1
Reel/Frame:
040257/0570Recorded: 11/08/2016Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/31/1999
Assignee:
8000 SOUTH FEDERAL WAY
BOISE, IDAHO 83707
Correspondent:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD
MAILDROP A700
PHOENIX, AZ 85008
Assignment: 2
Reel/Frame:
040275/0970Recorded: 11/10/2016Pages: 20
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/26/2008
Assignee:
C/O CITICO TRUSTEES (CAYMAN) LIMITED
REGATTA OFFICE PARK, WEST BAY ROAD
GRAND CAYMAN, CAYMAN ISLANDS Y1-1205
Correspondent:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD
MAILDROP A700
PHOENIX, AZ 85008

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