Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/30/2006
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Application #:
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11191463
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Filing Dt:
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07/27/2005
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Inventor:
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Tsing Chow Wang
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Title:
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PLANAR BOND PAD DESIGN AND METHOD OF MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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18 ZHANG JIANG ROAD, PUDONG NEW AREA |
SHANGHAI, PRC, CHINA 201203 |
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RICHARD T. OGAWA |
TOWNSEND AND TOWNSEND AND CREW LLP |
TWO EMBARCADERO CENTER |
EIGHTH FLOOR |
SAN FRANCISCO, CALIFORNIA 94111-3834 |
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