Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/06/2006
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Application #:
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10425538
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Filing Dt:
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04/28/2003
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Publication #:
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Pub Dt:
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09/09/2004
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Inventors:
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Neo Chee Peng, Tan Hock Chuan, Chew Beng Chye, David Chai Yih Ming et al
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Title:
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MICROELECTRONIC COMPONENT ASSEMBLIES EMPLOYING LEAD FRAMES HAVING REDUCED-THICKNESS INNER LENGTHS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 SOUTH FEDERAL WAY |
| P.O. BOX 6 |
| BOISE, IDAHO 83706-9632 |
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| PERKINS COID LLP |
| EDWARD S. HOTCHKISS |
| P.O. BOX 1247 |
| SEATTLE, WASHINGTON 98111-1247 |
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