Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/13/2006
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Application #:
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10667474
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Filing Dt:
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09/23/2003
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Publication #:
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Pub Dt:
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08/12/2004
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Inventors:
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Sung-Dae Cho, Sang-Jun Kim, Joo-Hyung Lee
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Title:
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SEMICONDUCTOR PACKAGE WITH PATTERN LEADS AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG, PALDAL-KU, SUWON |
| KYUNGGI-DO, KOREA, REPUBLIC OF |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| JOHN A. CASTELLANO |
| P.O. BOX 8910 |
| RESTON, VA 20195 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10F GOLDEN TOWER BLDG. |
| 511, SAMSEONG-RO, GANGNAM-GU |
| SEOUL, KOREA, REPUBLIC OF |
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| LEVENFELD PEARLSTEIN, LLC |
| 2 N. LASALLE STREET |
| SUITE 1300 |
| CHICAGO, IL 60602 |
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