Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/13/2006
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Application #:
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10003375
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Filing Dt:
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11/15/2001
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Inventor:
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Adrian E. Ong
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Title:
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LAYOUT AND USE OF BOND PADS AND PROBE PADS FOR TESTING OF INTEGRATED CIRCUITS DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2290 NORTH FIRST STREET, SUITE 201 |
| SAN JOSE, CALIFORNIA 95131 |
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| SIDLEY AUSTIN BROWN & WOOD LLP |
| PETER G. MIKHAIL |
| 555 CALIFORNIA STREET, SUITE 5000 |
| SAN FRANCISCO, CA 94104-1715 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4440 EL CAMINO REAL |
| LOS ALTOS, CALIFORNIA 94022 |
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| SHUN YAO |
| PARK, VAUGHAN & FLEMING, LLP |
| 2820 FIFTH STREET |
| DAVIS, CA 95618 |
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