Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/18/2006
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Application #:
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10710880
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Filing Dt:
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08/10/2004
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Publication #:
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Pub Dt:
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02/16/2006
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Inventors:
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Louis C. Hsu, Hsichang Liu, James R. Salimeno III
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Title:
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PARTIAL WAFER BONDING AND DICING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| FREDERICK W. GIBB, III |
| MCGINN & GIBB, PLLC |
| 2568-A RIVA ROAD |
| SUITE 304 |
| ANNAPOLIS, MD 21401 |
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