Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/06/2007
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Application #:
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10662433
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Filing Dt:
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09/16/2003
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Publication #:
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Pub Dt:
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03/17/2005
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Inventor:
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Wen-Ching Chen
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Title:
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CHIP SCALE PACKAGE STRUCTURE FOR AN IMAGE SENSOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 258, YUNG YI RD., TAI-PING CITY |
| TAICHUNG HSIEN, TAIWAN R.O.C. |
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| NO. 258, YUNG YI RD., TAI-PING CITY |
| TAICHUNG HSIEN, TAIWAN R.O.C. |
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| CHEN WEN CHING |
| P.O. BOX 2103, TAICHUNG |
| TAIWAN, REPUBLIC OF CHINA |
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