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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
02/06/2007
Application #:
10340558
Filing Dt:
01/09/2003
Publication #:
Pub Dt:
11/27/2003
Inventors:
Ali Pourkeramati, Eungjoon Park
Title:
STRUCTURE AND METHOD FOR PARALLEL TESTING OF DIES ON A SEMICONDUCTOR WAFER
Assignment: 1
Reel/Frame:
014194/0735Recorded: 06/24/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/20/2003
Exec Dt:
06/19/2003
Assignee:
3080 OLCOTT DRIVE, SUITE 215-D
SANTA CLARA, CALIFORNIA 95054
Correspondent:
TOWNSEND AND TOWNSEND AND CREW LLP
BARMAK SANI
TWO EMBARCADERO CENTER, 8TH FLOOR
SAN FRANCISCO, CA 94111-3834
Assignment: 2
Reel/Frame:
015494/0256Recorded: 12/23/2004Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/09/2004
Assignee:
2215-B RENAISSANCE DRIVE, SUITE 5
LAS VEGAS, NEVADA 89119
Correspondent:
TOWNSEND AND TOWNSEND AND CREW LLP
PATRICK R. JEWIK
TWO EMBARCADERO CENTER, EIGHTH FLOOR
SAN FRANCISCO, CALIFORNIA 94111-3834
Assignment: 3
Reel/Frame:
030488/0799Recorded: 05/27/2013Pages: 10
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/12/2013
Assignee:
2711 CENTERVILLE RD
SUITE 400
WILMINGTON, DELAWARE 19808
Correspondent:
FOLEY & LARDNER LLP
150 EAST GILMAN ST.
VEREX PLAZA
MADISON, WI 53701-1497

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