Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
04/10/2007
|
Application #:
|
11046514
|
Filing Dt:
|
01/28/2005
|
|
Publication #:
|
|
Pub Dt:
|
10/13/2005
| | | | |
|
Inventor:
|
Jeong-Woo Seo
|
|
Title:
|
SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 416, MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
|
|
|
|
| MARGER JOHNSON & MCCOLLOM, P.C. |
| 1030 S.W. MORRISON STREET |
| PORTLAND, OREGON 97205 |
|
|
Search Results as of:
04/27/2024 08:32 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
