Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/17/2007
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Application #:
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11250821
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Filing Dt:
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10/14/2005
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Inventor:
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Donald M. MacIntyre
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Title:
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METHOD OF FORMING HERMETIC WAFER SCALE INTEGRATED CIRCUIT STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3236 SCOTT BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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STALLMAN & POLLOCK LLP |
ATTN: MICHAEL J. POLLOCK |
353 SACRAMENT STREET, SUIT 2200 |
SAN FRANCISCO, CA 94111 |
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