Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/14/2007
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Application #:
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09832160
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Filing Dt:
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04/09/2001
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Publication #:
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Pub Dt:
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09/13/2001
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Inventors:
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Salman Akram, Alan G. Wood
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Title:
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WAFER-LEVEL PACKAGE AND METHODS OF FABRICATING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26 DEER CREEK LANE |
| MT. KISCO, NEW YORK 10549 |
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| CHRISTOPHER C. HENRY |
| ROPES & GRAY LLP |
| 1211 AVENUE OF THE AMERICAS |
| NEW YORK, NEW YORK 10036 |
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