Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/14/2007
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Application #:
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10687096
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Filing Dt:
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10/15/2003
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Publication #:
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Pub Dt:
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04/21/2005
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Inventor:
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James L. Voelz
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Title:
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METHODS FOR WAFER-LEVEL PACKAGING OF MICROELECTRONIC DEVICES AND MICROELECTRONIC DEVICES FORMED BY SUCH METHODS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 SOUTH FEDERAL WAY |
| P.O. BOX 6 |
| BOISE, IDAHO 83706-9632 |
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| PERKINS COIE, LLP |
| PAUL T. PARKER |
| P.O. BOX 1247 |
| SEATTLE, WA 98111-1247 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26 DEER CREEK LANE |
| MT. KISCO, NEW YORK 10549 |
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| CHRISTOPHER C. HENRY |
| ROPES & GRAY LLP |
| 1211 AVENUE OF THE AMERICAS |
| NEW YORK, NEW YORK 10036 |
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