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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7300857
Issue Dt:
11/27/2007
Application #:
10932296
Filing Dt:
09/02/2004
Publication #:
20060043599
Pub Dt:
03/02/2006
Inventors:
Steven Oliver, Salman Akram, Charles Watkins, Sidney Rigg, Mark Hiatt, Mark Tuttle et al
Title:
THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS
Assignment: 1
Reel/Frame:
019128/0663Recorded: 04/06/2007Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
AKRAM, SALMAN
Exec Dt:
12/30/2004
WATKINS, CHARLES
Exec Dt:
12/23/2004
HIATT, MARK
Exec Dt:
12/31/2004
HEMBREE, DAVID
Exec Dt:
12/23/2004
WARK, JAMES
Exec Dt:
12/27/2004
FARNWORTH, WARREN
Exec Dt:
12/23/2004
TUTTLE, MARK
Exec Dt:
12/29/2004
RIGG, SIDNEY
Exec Dt:
12/23/2004
OLIVER, STEVEN
Exec Dt:
12/23/2004
KIRBY, KYLE
Exec Dt:
12/23/2004
WOOD, ALAN
Exec Dt:
12/29/2004
VELICKY, LU
Exec Dt:
12/27/2004
Assignee:
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY
BOISE, IDAHO 83706-9632
Correspondent:
PERKINS COIE LLP
P.O. BOX 1247
PAUL T. PARKER
SEATTLE, WA 98111-1247
Assignment: 2
Reel/Frame:
035190/0219Recorded: 03/18/2015Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
MICRON TECHNOLOGY, INC.
Exec Dt:
03/13/2015
Assignee:
ROUND ROCK RESEARCH, LLC
2001 ROUTE 46
WATERVIEW PLAZA, SUITE 310
PARSIPPANY, NEW JERSEY 07054
Correspondent:
LDLK&M
600 SOUTH AVENUE WEST
WESTFIELD, NJ 07090

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