Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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04/15/2008
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Application #:
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11463740
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Filing Dt:
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08/10/2006
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Publication #:
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Pub Dt:
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02/14/2008
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Inventors:
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Che-Yu Li, Matti A. Korhonen
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Title:
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HIGH DENSITY ELECTRONIC PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 45 N. FULTON ST. |
| HOMER, NEW YORK 13077 |
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| MICHAEL BROWN |
| 400 M&T BANK BUILDING |
| 118 NORTH TIOGA STREET |
| ITHACA, NY 14850 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 128 LUQUER RD. |
| PORT WASHINGTON, NEW YORK 11050 |
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| BROWN & MICHAELS PC |
| 118 N. TIOGA ST. |
| ITHACA, NY 14850 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BLK 5000, #03-09 |
| ANG MO KIO AVE 5, TECHPLACE II |
| SINGAPORE, SINGAPORE 569870 |
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| MICHAEL F. BROWN |
| 118 NORTH TIOGA STREET - SUITE 400 |
| ITHACA, NY 14850 |
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