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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
04/29/2008
Application #:
10882468
Filing Dt:
06/30/2004
Publication #:
Pub Dt:
01/05/2006
Inventor:
Jiun Hann Sir
Title:
INTERCONNECTS WITH DIRECT METALIZATION AND CONDUCTIVE POLYMER
Assignment: 1
Reel/Frame:
020282/0547Recorded: 12/21/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/05/2004
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95052
Correspondent:
BLAKELY, SOKOLOFF, TAYLOR, & ZAFMAN LLP
1279 OAKMEAD PARKWAY
SUNNYVALE, CA 94085
Assignment: 2
Reel/Frame:
037733/0440Recorded: 02/08/2016Pages: 20
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/04/2016
Assignee:
THE RAINBOW CITY OFFICE BUILDING, 68 QINGHE MIDDLE STREET HAIDIAN DISTRICT
BEIJING, CHINA 100085
Correspondent:
CPA GLOBAL LTD
LIBERATION HOUSE
CASTLE STREET
ST HELIER, JE1 1BL JERSEY

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