Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/04/2008
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Application #:
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10708240
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Filing Dt:
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02/18/2004
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Publication #:
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Pub Dt:
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08/18/2005
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Inventors:
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Louis L. Hsu, Carl Radens, Li-Kong Wang
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Title:
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REDUNDANCY STRUCTURE AND METHOD FOR HIGH-SPEED SERIAL LINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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INTERNATIONAL BUSINESS MACHINES CORPORAT |
DEPT. 18G |
BLDG. 300-482 |
2070 ROUTE 52 |
HOPEWELL JUNCTION, NY 12533 |
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