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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/05/2009
Application #:
11141361
Filing Dt:
05/31/2005
Publication #:
Pub Dt:
06/15/2006
Inventors:
Athanasios J. Syllaios, John H. Tregilgas, Roland W. Gooch
Title:
SYSTEMS AND METHODS FOR SOLDER BONDING
Assignment: 1
Reel/Frame:
017060/0224Recorded: 10/06/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/29/2005
Exec Dt:
09/29/2005
Exec Dt:
09/29/2005
Assignee:
600 THIRD AVENUE
NEW YORK, NEW YORK 10016
Correspondent:
WILLIAM W. ENDERS
O'KEEFE, EGAN & PETERMAN
1101 CAPITAL OF TEXAS HIGHWAY SOUTH
BUILDING C, SUITE 200
AUSTIN, TX 78746
Assignment: 2
Reel/Frame:
063564/0207Recorded: 05/08/2023Pages: 5
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/31/2016
Assignee:
1025 W. NASA BLVD.
MELBOURNE, FLORIDA 32919
Correspondent:
MITCH EVANDER
1025 W. NASA BLVD.
MELBOURNE, FL 32919

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