Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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11/24/2009
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Application #:
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12100392
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Filing Dt:
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04/09/2008
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Publication #:
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Pub Dt:
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03/05/2009
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Inventors:
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Chun-Wei Tsai, Shih-Feng Shao
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Title:
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WAFER-LEVEL PACKAGING CUTTING METHOD CAPABLE OF PROTECTING CONTACT PADS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 566, KAO-SHI RD., YANG-MEI |
| TAOYUAN HSIEN, TAIWAN |
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| WINSTON HSU |
| P.O.BOX 506 |
| MERRIFIELD, VA 22116 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9F., NO. 170, SEC. 3, MIN CHUAN EAST RD., JHONGSHAN DIST., |
| TAIPEI, TAIWAN |
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| BACON & THOMAS, PLLC |
| 625 SLATERS LANE, 4TH FL. |
| ALEXANDRIA, VA 22314 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9F., NO. 170, SEC. 3, MIN CHUAN EAST ROAD, JHONGSHAN DIST., |
| TAIPEI, TAIWAN |
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| BACON&THOMAS, PLLC |
| 625 SLATERS LANE, 4TH FL |
| ALEXANDRIA, VA 22314 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3025 ORCHARD PARKWAY |
| SAN JOSE, CALIFORNIA 95134 |
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| XPERI CORPORATION |
| 3025 ORCHARD PARKWAY |
| SAN JOSE, CA 95134 |
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