Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/04/2010
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Application #:
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12186932
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Filing Dt:
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08/06/2008
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Publication #:
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Pub Dt:
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11/27/2008
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Inventors:
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Chih-Chao Yang, Haining Yang, Keith Kwong Hon Wong
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Title:
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DUAL LINER CAPPING LAYER INTERCONNECT STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1891 ROBERTSON ROAD |
| SUITE 100 |
| OTTAWA, CANADA K2H 5B7 |
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| ELPIS TECHNOLOGIES INC. |
| 1891 ROBERTSON ROAD |
| SUITE 100 |
| OTTAWA, K2H 5B7 CANADA |
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