Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/18/2010
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Application #:
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11625810
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Filing Dt:
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01/22/2007
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Publication #:
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Pub Dt:
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02/07/2008
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Inventor:
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ShouFang Chen
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Title:
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INTEGRATED CIRCUIT UTILIZING DOWN BOND TO DEFINE THE FUNCTION OF THE DIE AND THE IMPLEMENTING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4F-1, NO. 26, TAI-YUAN ST., CHUPEI |
| HSIN-CHU HSIEN, TAIWAN |
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| WINSTON HSU |
| P.O.BOX 506 |
| MERRIFIELD, VA 22116 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| NO. 1, DUSING 1ST RD. , HSINCHU SCIENCE PARK |
| HSINCHU CITY, TAIWAN 30078 |
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| MCCLURE, QUALEY & RODACK, LLP |
| 280 INTERSTATE NORTH CIRCLE SE |
| SUITE 550 |
| ATLANTA, GA 30339 |
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