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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
11/09/2010
Application #:
11800098
Filing Dt:
05/03/2007
Publication #:
Pub Dt:
11/06/2008
Inventors:
Jeffrey F. DeNatale, Stefan C. Lauxtermann
Title:
IMPROVED THROUGH-WAFER VIAS
Assignment: 1
Reel/Frame:
019364/0364Recorded: 05/03/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/30/2007
Exec Dt:
05/01/2007
Assignee:
P.O. BOX 1085
MAIL CODE A15
THOUSAND OAKS, CALIFORNIA 91358-0085
Correspondent:
KOPPEL, PATRICK, HEYBL & DAWSON
555 ST. CHARLES DRIVE, SUITE 107
THOUSAND OAKS, CA 91360
Assignment: 2
Reel/Frame:
027830/0206Recorded: 03/09/2012Pages: 8
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/21/2011
Assignee:
1049 CAMINO DOS RIOS
THOUSAND OAKS, CALIFORNIA 91360
Correspondent:
WENDY K. BILLINGSLEY
1049 CAMINO DOS RIOS
THOUSAND OAKS, CA 91360

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