Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/23/2010
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Application #:
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11773277
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Filing Dt:
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07/03/2007
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Publication #:
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Pub Dt:
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01/08/2009
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Inventors:
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Tjandra Winata Karta, Steven Hsu, Chien-Hsiun Lee, Jimmy Liang, Gene Wu
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Title:
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ENHANCED RELIABILITY OF WAFER-LEVEL CHIP-SCALE PACKAGING (WLCSP) DIE SEPARATION USING DRY ETCHING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C. 300-77 |
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| SLATER & MATSIL, L.L.P. |
| 17950 PRESTON ROAD |
| SUITE 1000 |
| DALLAS, TX 75252 |
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