Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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11/23/2010
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Application #:
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12617665
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Filing Dt:
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11/12/2009
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Inventor:
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Enchao Yu
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Title:
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HEAT SPREADER FOR MEMORY MODULES
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Assignment:
1
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| 1345 AVENUE OF THE AMERICAS, 46TH FLOOR |
| NEW YORK, NEW YORK 10105 |
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| RENEE PRESCAN |
| 300 NORTH LASALLE STREET |
| KIRKLAND & ELLIS LLP |
| CHICAGO, IL 60654 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 29F, SAMSUNG ELECTRONICS BLDG., 1320-10, SEOCHO 2-DONG |
| SEOCHO-GU, KOREA, REPUBLIC OF 137-857 |
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| DLA PIPER LLP (US) |
| 4365 EXECUTIVE DRIVE, SUITE 1100 |
| SAN DIEGO, CA 92121 |
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Assignment:
3
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TERMINATION OF INTELLECTUAL PROPERTY SECURITY AGREEMENT
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| 51 DISCOVERY, SUITE 150 |
| IRVINE, CALIFORNIA 92618 |
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| MORRISON & FOERSTER LLP |
| 425 MARKET STREET |
| SAN FRANCISCO, CA 94105 |
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Assignment:
4
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 111 ACADEMY WAY, SUITE 100 |
| IRVINE, CALIFORNIA 92617 |
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| JAMIE J. ZHENG |
| 3790 EL CAMINO REAL #1147 |
| PALO ALTO, CA 94306 |
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