Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/28/2010
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Application #:
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12181467
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Filing Dt:
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07/29/2008
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Publication #:
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Pub Dt:
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02/04/2010
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Inventors:
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Peter J. Lindgren, Edmund J. Sprogis, Anthony K. Stamper
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Title:
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IC CHIP AND DESIGN STRUCTURE WITH THROUGH WAFER VIAS DISHING CORRECTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| HOFFMAN WARNICK LLC |
| 75 STATE ST |
| 14TH FLOOR |
| ALBANY, NY 12207 |
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