Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/12/2011
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Application #:
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12346329
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Filing Dt:
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12/30/2008
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Publication #:
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Pub Dt:
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02/11/2010
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Inventors:
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Bily Wang, Sung-Yi Hsiao, Jack Chen
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Title:
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WAFER LEVEL LED PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 18, LANE 522, SEC. 5, JHONGHUA RD. |
| HSINCHU CITY, TAIWAN |
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| KILE GOEKJIAN REED & MCMANUS |
| 1200 NEW HAMPSHIRE AVE, NW |
| SUITE 570 |
| WASHINGTON, DC 20036 |
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