Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/19/2011
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Application #:
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11522985
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Filing Dt:
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09/19/2006
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Publication #:
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Pub Dt:
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03/20/2008
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Inventors:
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Hai-Ching Chen, Harold C.H. Hsiung, Henry Lo
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Title:
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INTEGRATED CIRCUIT DEVICES WITH MULTI-DIMENSIONAL PAD STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU 300-77, TAIWAN R.O.C. |
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| JOE MCKINNEY MUNCY |
| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8110 GATEHOUSE ROAD, SUITE 100 EAST |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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