Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/31/2011
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Application #:
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12577343
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Filing Dt:
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10/12/2009
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Publication #:
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Pub Dt:
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02/11/2010
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Inventors:
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Seng Guan Chow, Francis Heap Hoe Kuan
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Title:
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SEMICONDUCTOR ASSEMBLY WITH COMPONENT PADS ATTACHED ON DIE BACK SIDE
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Assignment:
1
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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39TH FLOOR, CITIBANK TOWER, CITIBANK PLAZA, 3 GARDEN ROAD |
ATTENTION: AGENCY AND TRUST |
CENTRAL, HONG KONG |
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LAWRENCE KASS |
28 LIBERTY STREET |
C/O LAWRENCE KASS |
NEW YORK, NY 10005 |
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Assignment:
2
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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46429 LANDING PARKWAY |
FREMONT, CALIFORNIA 94538 |
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5 YISHUN STREET 23 |
SINGAPORE, SINGAPORE 768442 |
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PATENT LAW GROUP: ATKINS AND ASSOCIATES |
123 W. CHANDLER HEIGHTS ROAD, #12535 |
CHANDLER, AZ 85248 |
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