Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/11/2011
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Application #:
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12709073
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Filing Dt:
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02/19/2010
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Publication #:
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Pub Dt:
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06/10/2010
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Inventors:
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Jeffrey D. Punzalan, Jose Alvin Caparas, Jae Hun Ku
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Title:
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LARGE DIE PACKAGE STRUCTURES AND FABRICATION METHOD THEREFOR
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Assignment:
1
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 39TH FLOOR, CITIBANK TOWER, CITIBANK PLAZA, 3 GARDEN ROAD |
| CENTRAL, HONG KONG |
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| MILBANK, TWEED, HADLEY & MCCLOY, LLP |
| 28 LIBERTY STREET |
| C/O LAWRENCE KASS |
| NEW YORK, NY 10005 |
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Assignment:
2
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 46429 LANDING PARKWAY |
| FREMONT, CALIFORNIA 94538 |
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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| PATENT LAW GROUP: ATKINS AND ASSOCIATES |
| 123 W. CHANDLER HEIGHTS ROAD, #12535 |
| CHANDLER, AZ 85248 |
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