Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/10/2012
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Application #:
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10845304
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Filing Dt:
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05/13/2004
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Publication #:
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Pub Dt:
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11/17/2005
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Inventors:
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Tongbi Jiang, J. Mike Brooks
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Title:
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COVERS FOR MICROELECTRONIC IMAGERS AND METHODS FOR WAFER-LEVEL PACKAGING OF MICROELECTRONICS IMAGERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 SOUTH FEDERAL WAY |
| P.O. BOX 6 |
| BOISE, IDAHO 83716-9632 |
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| PERKINS COIE LLP |
| PAUL T. PARKER |
| P.O. BOX 1247 |
| SEATTLE, WA 98111-1247 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| C/O CITCO TRUSTEES (CAYMAN) LTD. |
| REGATTA OFFICE PARK, WEST BAY ROAD |
| GRAND CAYMAN, CAYMAN ISLANDS Y1-1205 |
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| THOMAS J. D'AMICO-DICKSTEIN SHAPIRO LLP |
| 1825 EYE STREET NW |
| M4065.1296/P1296 |
| WASHINGTON, DC 20006-5403 |
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