Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/08/2012
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Application #:
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12573110
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Filing Dt:
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10/03/2009
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Publication #:
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Pub Dt:
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01/28/2010
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Inventors:
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Cheonhee Lee, Youngnam Choi
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFRAME SUBSTRATE
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Assignment:
1
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 39TH FLOOR, CITIBANK TOWER, CITIBANK PLAZA, 3 GARDEN ROAD |
| ATTENTION: AGENCY AND TRUST |
| CENTRAL, HONG KONG |
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| LAWRENCE KASS |
| 28 LIBERTY STREET |
| C/O LAWRENCE KASS |
| NEW YORK, NY 10005 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE |
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| YANGZHOU DU |
| 8407 CENTRAL AVE, SUITE 2077 |
| NEWARK, CA 94560-3431 |
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Assignment:
3
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 46429 LANDING PARKWAY |
| FREMONT, CALIFORNIA 94538 |
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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| PATENT LAW GROUP: ATKINS AND ASSOCIATES |
| 123 W. CHANDLER HEIGHTS ROAD, #12535 |
| CHANDLER, AZ 85248 |
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