Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/21/2013
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Application #:
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12562387
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Filing Dt:
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09/18/2009
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Publication #:
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Pub Dt:
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03/24/2011
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Inventors:
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Jong Sik PAEK, In Bae PARK, Chang Deok LEE
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Title:
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STACKABLE WAFER LEVEL PACKAGE AND FABRICATING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 280-8, SUNGSU 2GA 3 DONG |
| SUNGDONG-GU |
| SEOUL, KOREA, REPUBLIC OF |
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| R. BURNS ISRAELSEN |
| 1000 EAGLE GATE TOWER |
| 60 EAST SOUTH TEMPLE |
| SALT LAKE CITY, UT 84111 |
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Assignment:
2
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PATENT SECURITY AGREEMENT
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| 901 MAIN STREET, 11TH FLOOR |
| DALLAS, TEXAS 75202 |
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| STEPHEN P. DEMM - HUNTON & WILLIAMS LLP |
| 951 EAST BYRD STREET |
| RIVERFRONT PLAZA - EAST TOWER |
| RICHMOND, VA 23219-4074 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 333 SOUTH HOPE STREET |
| 19TH FLOOR |
| LOS ANGELES, CALIFORNIA 90071 |
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| MCGUIREWOODS LLP |
| 1750 TYSONS BOULEVARD |
| SUITE 1800 |
| TYSONS, VA 22102 |
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