Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/12/2013
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Application #:
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13328529
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Filing Dt:
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12/16/2011
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Publication #:
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Pub Dt:
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06/21/2012
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Inventors:
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Noriyoshi Shimizu, Akio Rokugawa, Hirokazu Yoshino
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Title:
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SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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CANTOR COLBURN, LLP |
20 CHURCH STREET |
22ND FLOOR |
HARTFORD, CT 06103 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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80, OSHIMADA-MACHI |
NAGANO-SHI, NAGANO, JAPAN 381-2287 |
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RANKIN HILL AND CLARK LLP |
38210 GLENN AVENUE |
WILLOUGHBY, OH 44094 |
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