Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/29/2014
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Application #:
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12291293
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Filing Dt:
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11/07/2008
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Publication #:
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Pub Dt:
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05/13/2010
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Inventor:
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Jacob Chi Wing Leung
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Title:
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Multi-chip light emitting diode modules
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| UNIT 301, 3F, PHOTONICS CENTRE, 2 SCIENCE PARK EAST AVE. |
| HONG KONG SCIENCE PARK, SHATIN |
| NEW TERRITORIES, HONG KONG |
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| JAYE G. HEYBL |
| KOPPEL PATRICK HEYBL & DAWSON |
| 2815 TOWNSGATE ROAD |
| SUITE 215 |
| WESTLAKE VILLAGE, CA 91361 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4400 SILICON DRIVE |
| DURHAM, NORTH CAROLINA 27703 |
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| WITHROW + TERRANOVA |
| 106 PINEDALE SPRINGS WAY |
| CARY, NC 27511 |
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