Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/09/2014
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Application #:
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13931688
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Filing Dt:
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06/28/2013
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Inventors:
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Lawrence A. Clevenger, Yiheng Xu, Edem Wornyo, John H. Zhang, Carl Radens
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Title:
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THROUGH SILICON VIA STRUCTURE FOR INTERNAL CHIP COOLING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| HAYLEY J. TALBERT |
| 701 FIFTH AVENUE |
| SUITE 5400 |
| SEATTLE, WA 98104 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MAIL STATION 2346, 750 CANYON DRIVE |
| SUITE 300 |
| COPPELL, TEXAS 75019 |
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| HAYLEY J. TALBERT |
| 701 FIFTH AVENUE |
| SUITE 5400 |
| SEATTLE, WA 98104 |
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