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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
01/27/2015
Application #:
13800383
Filing Dt:
03/13/2013
Publication #:
Pub Dt:
09/18/2014
Inventors:
Wen-Yi Lin, Cheng-Yi Hong, Ming-Chih Yew, Po-Yao Lin, Kuo-Chuan Liu
Title:
Semiconductor Device Package and Method
Assignment: 1
Reel/Frame:
033925/0591Recorded: 10/09/2014Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/25/2013
Exec Dt:
03/25/2013
Exec Dt:
03/25/2013
Exec Dt:
03/25/2013
Assignee:
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
SLATER & MATSIL, LLP
17950 PRESTON RD.
SUITE 1000
DALLAS, TX 75252
Assignment: 2
Reel/Frame:
033925/0651Recorded: 10/09/2014Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/25/2013
Exec Dt:
03/25/2013
Exec Dt:
03/25/2013
Exec Dt:
03/25/2013
Exec Dt:
03/25/2013
Assignee:
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
SLATER & MATSIL, LLP
17950 PRESTON RD.
SUITE 1000
DALLAS, TX 75252

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