Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/30/2015
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Application #:
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14054033
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Filing Dt:
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10/15/2013
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Publication #:
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Pub Dt:
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02/06/2014
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Inventors:
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Michel J. Abou-Khalil, Robert J. Gauthier JR., Tom C. Lee, Junjun Li, Souvick Mitra et al
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Title:
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THROUGH SILICON VIA REPAIR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| WOOD, HERRON & EVANS, LLP (IBM-BUR) |
| 2700 CAREW TOWER |
| 441 VINE STREET |
| CINCINNATI, OH 45202 |
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