Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/01/2015
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Application #:
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13719366
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Filing Dt:
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12/19/2012
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Publication #:
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Pub Dt:
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06/19/2014
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Inventors:
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Kenneth J. Goodnow, Todd E. Leonard, Stephen G. Shuma, Peter A. Twombly
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Title:
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THREE-DIMENSIONAL INTER-CHIP CONTACT THROUGH VERTICAL DISPLACEMENT MEMS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| FREDERICK W. GIBB, III GIBB & RILEY, LLC |
| 844 WEST STREET |
| SUITE 100 |
| ANNAPOLIS, MD 21401 |
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